03 Feb 2012 | 4:01 PM | CR $49.65  0.840  volume 287,200
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SPOTLIGHT

microelectronics

 
CONTACT
Crane Aerospace & Electronics
10301 Willows Road
Redmond, WA 98052

Mail: PO Box 97005
Redmond, WA 98073-9705

PHONE +1 425 895 3007
FAX +1 425 882 1990

WEBSITE


Through the Interpoint brand, Crane specializes in miniaturization of electronic circuits to reduce size, minimize weight and increase board density. Our services and test system development capabilities complement the expertise and experience gained in over 40 years of manufacturing chip-and-wire, chip-on-board, chip-on-flex, surface mount or mixed technology products. Microelectronics Solutions are offered for build-to-print, co-development, or turnkey applications to meet customer demand for time-to-market and time-to-volume.

Flip chip and ball grid awway (BGA)

 

Flip chip and ball grid array (BGA)

 

 

 

Hermetically Sealed Multichip Module

 

Hermetically Sealed Multichip Module

 

 

 

Chip Scale Package on Hardflex

 

Chip Scale Package on Hardflex